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AGC delivers slurries and polishing solutions for CMP processes as the fully integrated manufacturer from abrasive production.
To realize multi-layered structures with high levels of flatness and zero defects, we optimize our slurries with high planarization and selectivity control technologies for not only silicon-based materials such as poly-Si, SiO2 and SiN, but also metals and resin that fulfill various technical requirements from CMP processes in semiconductor front-end, back-end, packaging and so on.

  • Design and manufacturing of abrasive particles
  • Accumulated technology of polishing materials for glasses
  • Design and manufacturing of various analyses and chemical liquid
  • Polishing material evaluation technology
  • CMP processes in semiconductor front-end, back-end, packaging and so on.
  • *Examples of polishing materials: Silicon-based materials (poly-Si, SiO2, SiN), metals, resin

CES-300 Series/330F Series

・Slurry for STI Applications

・Slurry for ILD Applications

 

Ceria slurry for STI/ILD Applications

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