Miniaturization
It enables micro wiring with excellent flatness, shape stability, and through fine via of the glass.
High speed
It enables high speed and large capacity communication with excellent high frequency properties, through high insulation and low dielectric loss tangent of the glass.
High reliability
It is best suited to the semiconductor packaging with non-alkali glass and coefficient of thermal expansion close to Si.
High productivity
It can support a wafer, as well as a panel size.
 

• Substrate for Semiconductor Packaging and Glass Interposer
• 3D Glass IPD
• MEMS, Sensor Device

Basic specifications

• Consult with us separately for the glass material other than the above.
• The above hole sizes may be limited depending on the glass thickness.
• The hole shapes may be limited depending on the glass thickness and hole diameter.

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