This glass substrate is suitable as a carrier substrate for the process in semiconductor packaging. 
In recent years, the technology of packaging in a state of wafer (wafer level packaging) has become widespread, replacing the conventional packaging by individual piece. As a result, the needs are growing for glass as a carrier substrate in the packaging process of semiconductor.
AGC offers a glass wafer and a glass panel which are high quality and easy to use.
It supports a wafer size φ300 mm and others, and a panel size equivalent to 500 mm square and others. Additionally, it also supports the requirement of high flatness, high smoothness, notch, and ID marking.