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Adhesive Fluon+ EA-2000 resin is drawing a lot of attention as a material for 5G-compatible printed circuit boards that are used in higher frequency bands. While retaining the excellent inherent characteristics of fluoropolymers such as heat resistance and electrical characteristics, Fluon+ EA-2000 provides superior adhesion, which enhances processing capabilities and the reliability of printed circuit boards.In addition Fluon+ EA-2000 makes it possible to enhance the electrical characteristics of materials by being overlayed or dispersed on other materials.

 

  • Low dielectric constant (2.0) and low dissipation factor (0.001)
  • Excellent adhesion to smooth copper foils – Minimize loss and delay for high frequency applications due to the skin effect
  • Stable dielectric constant versus temperature and frequency
  • Very low moisture uptake (0.03%)
  • Automotive radar applications
  • 5G cellular telecommunication systems – feedline and antennas
  • Other mmWave applications
  • High speed digital applicatio

Products

Features

Fluon+ EA-2000 Film

Thickness: 12μm 25μm 38μm 50μm 75μm

Fluon+ EA-2000 Powder

Particle size D50: 2~3μm (10kg/package)

Fluon+ EA-2000 Dispersion

Solvent: water , Solid content: 40wt% (15kg/package)

 

 

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